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Battery Cell Module Potting 2.0 High Thermal Conductivity Silicone Potting Compound 1:1

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Battery Cell Module Potting 2.0 High Thermal Conductivity Silicone Potting Compound 1:1

Name: Battery Cell Module Potting 20 High Thermal Conductivity Silicone Potting Compound 11
Brand: Hanast
Price: 1 USD

Buy cheap Battery Cell Module Potting 2.0 High Thermal Conductivity Silicone Potting Compound 1:1 product

Model Number : HN-8820

Packaging Details : 50KG/set, 25KG/bar

MOQ : 1-2KG

Hardness : 50±5 SHORE A

Cusomization : Support

Color : Grey,white,black

Application : New Energy Vehicle Power Batteries and Thermal Management Systems

Name : silicone potting compound for electronics

Price : Negotiable

Payment Terms : T/T、paypal

Shelf time : 6months

Features : 2.0 thermal conductivity

Place of Origin : Guangdong, China

Brand Name : Hanast

MOQ : 1KG

Delivery Time : 5-7days

Supply Ability : 100ton/month

Mix ratio : 1:1

wide temperature range : -50°C to 250°C

Certification : ROHS

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Battery Cell Module Potting 2.0 High Thermal Conductivity Silicone Potting Compound 1:1

Product Overview for silicone potting compound:
High-conductivity potting compound is a two-component, thermally conductive silicone potting material. Utilizing an addition-curing silicone rubber system, it consists of two components—A and B—which, after being mixed in a 1:1 ratio, cure at room or moderate temperatures. The curing process generates no low-molecular-weight byproducts and exhibits low shrinkage. Its thermal conductivity can reach up to 3.0 W/m·K.

Technical Parameters for silicone potting compound:

Exterior:grey liquid
viscosity:2000-3000cps
hardness:45-50shore A
thermal conducitivity:2.0(W/M▪K)
Flame retardant rating (V) (UL94):V-0

Wide temperature range (-40℃-150℃)

Product Applications for silicone potting compound:

5G Communications, Microinverters, and Precision Electronics; Third-Generation Semiconductors and Power Module Packaging; New Energy Vehicle Power Batteries and Thermal Management Systems

How to use silicone potting compound:

Weigh & Stir: Accurately weigh components A and B in a 1:1 ratio. Stir each part thoroughly before mixing to disperse any settled fillers and ensure consistent performance.
Mix Thoroughly: Blend the two parts (by hand or machine) until the color is completely uniform. Tip: If mixing manually, work in small batches so the glue stays fluid and easy to pour.
Degas: Place the mixed glue into a vacuum chamber to completely remove any trapped air bubbles. [1]
Pot: Pour the bubble-free glue into your device. Tip: Ensure your device and mixing containers are completely clean and dry before starting.

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