Clear Epoxy Potting Compound For Transformer 2:1 Potting Epoxy For Electronics AB Glue
Description of Epoxy Potting Compound
2:1 transparent epoxy potting compound is a high-performance, two-component, room-temperature-curing encapsulant. Its key features include exceptional transparency, high hardness, and excellent electrical insulation. Once cured, the adhesive layer is both rigid and clear, providing effective protection for precision electronic components while also meeting aesthetic requirements in applications where appearance matters.
technical parameter of epoxy potting compound:
Model:HN-5506A/B
Color:Transparent
Curing time (25℃):12-24H
Hardness (shore D):70-75
Thermal conductivity
(w/m.k):0.2-0.3
Temperature resistance(℃):-40-120℃
Product Features of epoxy potting compound:
Mixing Ratio: 2:1 (by weight). Features high transparency, high hardness, and excellent insulating properties; once cured, the adhesive layer is rigid and crystal-clear.
It maintains stable physical and electrical properties across a wide temperature range: from -45°C to 120°C.
After mixing, it exhibits excellent flowability, allowing it to easily penetrate into the minute gaps between components.
It also possesses anti-yellowing characteristics, making it suitable for applications involving prolonged exposure to light or those requiring the preservation of transparency.
Application of epoxy resin potting:
Based on its core characteristics of "transparency" and "hardness," 2:1 transparent epoxy potting compound is primarily utilized in the following two major product categories:
1. Electronic modules requiring transparent observation or light transmission: LED modules and lighting fixtures, electrical components featuring indicator lights, and aquarium pumps.
2. Precision components requiring high-level confidentiality or physical protection: Confidentiality modules, high-voltage components, precision sensors, relays, and similar devices.
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